led lighting ic lc5222 d sanken electric co.,ltd. 1 / 8 1 3 october 2011 description lc52 2 2 d is non - isolated type driver ic for led lighting which can achieve high efficiency in simple circuitry. its compact package which includes output mosfet and control ler, and low external components are suitable for small lighting equipment which requires saving space, like led light bulb. to meet various requirements, buck - boost operation which has wide input/output capability is available. and also, c ontrol function s with ref input are implemented. its high voltage capability allows direct connection to rectified ac supply. open protection for buck - boost operation and variable ocp improve safeness . package package: dip 8 ? led lighting equipment ? led light bulb main specification mosfet 250 v (min) , 2.2 (max) output current 0.5a (max) main supply voltage 250 v ( m ax ) features ? buck - boost operation in addition to no rmal buck operation, buck - boost operation which can both step - up and down is also available , to operate in wide input/output condition. ? open protection for buck - boost operation protection circuit to prevent damage when load open failure in buck - boost operation. ? built - in reference voltage for current setting precision and easy current setting. ? sleep function latch off the output by ref pin input voltage. ? disable function shut off led current by ref pin input voltage. ? dip8 package o utput mosfet and controller are included in one package. ? high voltage supply input ? built - in constant current controller - pwm mod e c urrent control circuitry. - adjustable output current by input voltage to ref pin. ? external pwm dimming ? variable type over current p rotection (ocp) - latch type operation - ocp t hreshold is adjusted by setting current and temperature to ensure protecti on. ? under voltage lockout protection (uvlo) ? th ermal shutdown protection (tsd) typical application circuit http://www.sanken - ele.co.jp f u s e v b b o u t s e n g n d r e g p w m r e f r 1 r 2 c p w m r s l e d d 1 l 1 c 2 c 1 l c 5 2 2 2 c i n a c i n p u t v i n l i n e f i l t e r v l e d
led lighting ic lc5222 d sanken electric co.,ltd. 2 / 8 1 3 october 2011 1 scope the present specifications shall apply to a led driver ic for led lighting, lc52 2 2 d. 2 outline type hybrid integrated circuit structure plastic molded (transfer mold) applications led lighting 3 absolute maximum ratings ( ta=25 ) parameter termina l symbol ratings units remarks main power supply voltage 6 ? 8 v bb 2 50 v output breakdown voltage 5 ? 4 vo 2 50 v output current 5 ? 4 i o 0.5 1 a exclude pulse width<1 s pwm pin voltage 2 ? 8 v pwm ? 0.3 v z 2 v ref pin voltage 3 ? 8 v ref - 0.3 v z 2 v sen pin voltage 4 ? 8 v sen - 0.3 4 .0 v exclude pulse width<1 s allowable power dissipation D p d 1.73 3 w mounted on pw b 4 junction temperature D t j 150 operating temperature range D t a ? 40 105 storage temperature range D t stg ? 40 150 1 output current rating may be limited by duty cycle, ambient temperature, and heat sinking. under any set of conditions, do not exceed the specified junction temperature (t j ). 2 v z here is breakdown voltage of zener diode which is internally connected to between pins and gnd. (v z =6.3v typ.) maximum input current is 1ma. 3 allowable power dissipation depends on pwb pattern layout. 4 mounted on sanken e val uation b oard .
led lighting ic lc5222 d sanken electric co.,ltd. 3 / 8 1 3 october 2011 4 electrical characteristic (ta=25c, v bb =140v, unless otherwise noted.) parameter termina l symbol ratings units remarks m in t yp m ax power supply current 6 ? 8 i bb s D 1 1.5 ma at disable 6 ? 8 i bb D 2.5 4.0 m a at enable output mosfet breakdown voltag e 5 ? 4 v ( br )dss 2 50 D D v i d =1ma output mosfet on resistance 5 ? 4 r ds(on) D 1.2 2.2 i d =0.5a body diode forward voltage 4 ? 5 v f D 0. 8 1.0 v i f =0.5a uvlo threshold (turn on) 6 ? 8 v uvlo ( on ) D 14 D v uvlo threshold (turn off) 6 ? 8 v uvlo ( off ) D 1 2 D v reg output voltage 1 ? 8 v reg 9.6 1 0 1 0.4 v i reg =0ma reg output current 1 ? 8 i reg D D ? 2 ma v reg = 9v enable voltage 3 ? 8 v enb D 0.15 0.19 v sleep voltage 3 ? 8 v slp 2.85 3.0 D v ref pin input current 3 ? 8 i ref ? 10 D 1 0 a current control detection voltage 4 - 8 v sen 0.4 v ref ? 0.03 0.4 v ref 0.4 v ref +0.0 3 v v ref =0.2~2.0 v 0.77 0.8 0.83 v v ref =2.0~3.0 v ocp detection voltage 4 ? 8 v ocp D 0.4 v ref +0.7 D v v ref =0.2~2.0 v D 1.5 D v v ref =2.0~3.0 v sen pin input current 4 ? 8 i sen ? 10 D 1 0 a pwm pin low voltage 2 ? 8 v pwml D 2 D v pwm pin high voltage 2 ? 8 v pwmh D 3 D v pwm pin output current 2 ? 8 i pwm D ? 2 0 D a pwm blanking time D t blkp D 0. 3 D s ocp blanking time D t blk o D 0. 2 D s pwm frequency 2 ? 8 f pwm D D 200 5 khz d uty=50% pwm off time D t off D 17 D s c pwm = 100pf rise time 5 ? 4 t r D 25 D ns i o =0.4a fall time 5 ? 4 t f D 5 0 D ns i o =0.4a thermal shutdown threshold D t tsd D 150 D c temperature of control ic thermal shutdown hysteresis D t tsdhy s D 55 D c 5 operation at a pwm frequency greater than f pwm is possible but not warranted.
led lighting ic lc5222 d sanken electric co.,ltd. 4 / 8 1 3 october 2011 thermal d ata power dissipation versus ambient temperature 0 25 50 75 100 125 150 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 temperature rise t[ ] total power dissipation p d [w] 0 0.5 1 1.5 2 0 25 50 75 100 125 150 allowable package power dissipation p d [ w ] ambient temperature t a [ ] p d 1.73w
led lighting ic lc5222 d sanken electric co.,ltd. 5 / 8 1 3 october 2011 5 functional block diagram ( pin assignment) pin assignment number name function 1 reg output of 10v internal regulator 2 pwm pwm control 3 ref setting output current and operation 4 sen current sensing 5 out output (power mosfet drain) 6 vbb power supply 7 c o n t r o l i c o p p l o g i c g a t e d r i v e r u v l o t s d b a n d g a p r e f e r e n c e r e g u l a t o r o c p b l a n k i n g p w m c o n t r o l b l o c k r e f e r e n c e c o n t r o l b l o c k c c _ r e f o c p _ r e f l o g i c b l o c k t s d u v l o p w m o c p o p p s l e e p e n a b l e r e g v b b r e f p w m g n d c u r r e n t d e t e c t b l o c k c c o c o p s e n o u t p w m _ i n s e n _ i n
led lighting ic lc5222 d sanken electric co.,ltd. 6 / 8 1 3 october 2011 6 package 6.1 package drawing and material ? dip8 package terminal material : cu terminal treatment: s older plating (pb - free) 6.2 appearance the body shall be clean and shall not bear any stain, rust or flaw. 6.3 marking the type number and lot number shall be clearly marked by laser so that cannot be erased easily. lc dimensions in mm marking position contents indication d k s
led lighting ic lc5222 d sanken electric co.,ltd. 7 / 8 1 3 october 2011 7 cautions and warnings since reliability can be affected adversely by improper storage environment and handling methods during characteristic tests, please observe the following cautions. 7.1 cautions for storage ? ensure that storage conditions c omply with the standard temperature (5 to 35 ) and the standard relative humidity (around 40 to 75%) and avoid storage locations that experience extreme changes in temperature or humidity. ? avoid locations where dust or harmful gases are present and avoid d irect sunlight. ? reinspect for rust in leads and solderability that have been stored for a long time. 7.2 cautions for characteristic tests and handling ? when characteristic tests are carried out during inspection testing and other standard tests periods, protect the devices from surge of power from the testing device, shorts between the devices and the heatsink. 7.3 considerations to protect the products from electrostatic discharge ? when handling the devices, operator must be grounded. grounded wrist straps be worn and should have at least 1m of resistance near operators to ground to prevent shock hazard. ? workbenches where the devices are handled should be grounded and be provided with conductive table and floor mats. ? when using measuring equipment such as a curve tracer, the equipment should also be grounded. ? when soldering the devices, the head of a soldering iron or a solder bath must be grounded in other to prevent leak voltage generated by them from being applied to the devices. ? t he devices should always be stored and transported in our shipping containers or conductive containers, or be wrapped up in aluminum foil.
led lighting ic lc5222 d sanken electric co.,ltd. 8 / 8 1 3 october 2011 7.4 others ? the contents in this document are subject to changes, for improvement and other purposes, without notice. make sure that this is the latest revision of the document before use. ? application and operation examples described in this document are qu oted for the sole purpose of reference fo r the use of the products herein and sanken can assume no responsibility for any infringement of industrial property rights, intellectual property rights or any other rights of sanken or any third party which may result from its use. ? although sanken undert akes to enhance the quality and reliability of its products, the occurrence of failure and defect of semiconductor products at a certain rate is inevitable. users of sanken products are requested to take, at their own risk, preventative measures including safety design of the equipment or systems against any possible injury, death, fires or damages to the society due to device failure or malfunction. ? sanken products listed in this document are designed and intended for the use as components in general purpose electronic equipment or apparatus (home appliances, office equipment, telecommunication equipment, measuring equipment, etc.). when considering the use of sanken products in the applications where high er reliability is required (transportation equipmen t and its control systems, traffic signal control systems or equipment, fire/crime alarm systems, various safety devices, etc.), and whenever long l ife expectancy is required even in general purpose electronic equipment or apparatus, please contact your nearest sanken sales representative to discuss , prior to the use of the products herein . the use of sanken p roducts without the written consent of san ken in the applications where extremely high reliability is required (aerospace equipment, nuclear power control systems, life support systems, etc.) is strictly prohibited. ? in the case that you use our semiconductor devices or design your products by using our semiconductor devices, the reliability largely depends on the degree of derating to be made to the rated values. derating may be interpreted as a case that an operation range is set by derating the load from each rated value or surge voltage or noise is considered for derating in order to assure or improve the reliability. in general, derating factors include electric stresses such as electric voltage, electric current, electric power etc., environmental stresses such as ambient temperature, humidity etc. and thermal stress caused due to self - heating of semiconductor devices. for these stresses, instantaneous values, maximum values and minimum values must be taken into co nsideration. in addition, it should be noted that since power devices or ics including power devices have large self - heating value, the degree of derating of junction temperature (tj) affects the reliability significantly. ? when using the products specifi ed herein by either (i) combining other products or materials therewith or (ii) physically, chemically or otherwise processing or treating the products, please duly consider all possible risks that may result from all such uses in advance and proceed there with at your own responsibility. ? anti radioactive ray design is not considered for the products listed herein. ? sanken assumes no responsibility for any troubles, such as dropping products caused during trans portation out of sanken s distribution network . ? t he contents in this document must not be transcribed or copied without sankens written consent.
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